Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7977803 | Chip structure with bumps and testing pads | Chiu-Ming Chou, Chien-Kang Chou, Chu-Fu Lin | 2011-07-12 |
| 7855461 | Chip structure with bumps and testing pads | Chiu-Ming Chou, Chien-Kang Chou, Chu-Fu Lin | 2010-12-21 |
| 7394161 | Chip structure with pads having bumps or wirebonded wires formed thereover or used to be tested thereto | Chiu-Ming Chou, Chien-Kang Chou, Chu-Fu Lin | 2008-07-01 |