Issued Patents All Time
Showing 26–50 of 74 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7919867 | Chip structure and process for forming the same | Jin-Yuan Lee, Mou-Shiung Lin | 2011-04-05 |
| 7915157 | Chip structure and process for forming the same | Jin-Yuan Lee, Mou-Shiung Lin | 2011-03-29 |
| 7915734 | Chip structure and process for forming the same | Jin-Yuan Lee, Mou-Shiung Lin | 2011-03-29 |
| 7906849 | Chip structure and process for forming the same | Jin-Yuan Lee, Mou-Shiung Lin | 2011-03-15 |
| 7906422 | Chip structure and process for forming the same | Jin-Yuan Lee, Mou-Shiung Lin | 2011-03-15 |
| 7898058 | Integrated chip package structure using organic substrate and method of manufacturing the same | Mou-Shiung Lin, Jin-Yuan Lee | 2011-03-01 |
| 7863739 | Low fabrication cost, fine pitch and high reliability solder bump | Jin-Yuan Lee, Mou-Shiung Lin | 2011-01-04 |
| 7796955 | Expandable wireless transceiver | Jiahn-Rong Gau, Cheng-Hsiung Hsu, Tzu-Ping Lin, Chen-Chia Huang | 2010-09-14 |
| 7772341 | Norbornene compounds with cross-linkable groups and their derivatives | Der-Jang Liaw, Shou-Mau Hong, Ming-Hung Huang | 2010-08-10 |
| 7728090 | Norbornene compounds with cross-linkable groups and their derivatives | Der-Jang Liaw, Shou-Mau Hong, Ming-Hung Huang | 2010-06-01 |
| 7645915 | Composite dressing | Su-Huei Lai, Yung-Sheng Lin, Ting-Kai Leung | 2010-01-12 |
| 7511376 | Circuitry component with metal layer over die and extending to place not over die | Mou-Shiung Lin, Jin-Yuan Lee | 2009-03-31 |
| 7498196 | Structure and manufacturing method of chip scale package | Jin-Yuan Lee, Mou-Shiung Lin | 2009-03-03 |
| 7482259 | Chip structure and process for forming the same | Jin-Yuan Lee, Mou-Shiung Lin | 2009-01-27 |
| 7470988 | Chip structure and process for forming the same | Mou-Shiung Lin, Jin-Yuan Lee | 2008-12-30 |
| 7468316 | Low fabrication cost, fine pitch and high reliability solder bump | Jin-Yuan Lee, Mou-Shiung Lin | 2008-12-23 |
| 7465653 | Reliable metal bumps on top of I/O pads after removal of test probe marks | Chuen-Jye Lin, Ming-Ta Lei, Mou-Shiung Lin | 2008-12-16 |
| 7413929 | Integrated chip package structure using organic substrate and method of manufacturing the same | Jin-Yuan Lee, Mou-Shiung Lin | 2008-08-19 |
| 7397117 | Chip package with die and substrate | Mou-Shiung Lin, Jin-Yuan Lee | 2008-07-08 |
| 7388055 | Functional norbornenes and polymeric derivatives and fabrication thereof | Der-Jang Liaw, Jing-Yang Ju, Jiun-Tyng Liaw | 2008-06-17 |
| 7368509 | Functional norbornenes and polymeric derivatives and fabrication thereof | Der-Jang Liaw, Jing-Yang Ju, Jiun-Tyng Liaw | 2008-05-06 |
| 7368508 | Functional norbornenes and polymeric derivatives and fabrication thereof | Der-Jang Liaw, Jing-Yang Ju, Jiun-Tyng Liaw | 2008-05-06 |
| 7355288 | Low fabrication cost, high performance, high reliability chip scale package | Jin-Yuan Lee, Ming-Ta Lei, Chuen-Jye Lin | 2008-04-08 |
| 7345365 | Electronic component with die and passive device | Jin-Yuan Lee, Mou-Shiung Lin | 2008-03-18 |
| 7338890 | Low fabrication cost, high performance, high reliability chip scale package | Jin-Yuan Lee, Ming-Ta Lei, Chuen-Jye Lin | 2008-03-04 |