Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7156904 | Bonding layer forming solution, method of producing copper-to-resin bonding layer using the solution, and layered product obtained thereby | Mutsuyuki Kawaguchi, Satoshi Saito, Jun Hisada, Naomi Kanda | 2007-01-02 |
| 7029761 | Bonding layer for bonding resin on copper surface | Mutsuyuki Kawaguchi, Satoshi Saito, Jun Hisada | 2006-04-18 |
| 6733886 | Laminate and method of manufacturing the same | Mutsuyuki Kawaguchi, Jun Hisada | 2004-05-11 |
| 6106899 | Method for surface treatment of copper or copper alloys | Ryo Ogushi | 2000-08-22 |
| 5965036 | Microetching composition for copper or copper alloy | Yoshiro Maki, Yasushi Yamada, Takashi Haruta, Maki Arimura | 1999-10-12 |
| 5885476 | Composition for microetching copper or copper alloy | Yoong-koo Hong | 1999-03-23 |
| 5807493 | Microetching method for copper or copper alloy | Yoshiro Maki, Yasushi Yamada, Takashi Haruta, Maki Arimura | 1998-09-15 |
| 5700389 | Etching solution for copper or copper alloy | — | 1997-12-23 |
| 5532094 | Composition for treating copper or copper alloy surfaces | Maki Arimura, Daisaku Akiyama | 1996-07-02 |
| 5496590 | Composition for treating copper and copper alloy surfaces and method for the surface treatment | Yoshiro Maki, Yoshiaki Furukawa, Minoru Outani, Takashi Haruta, Maki Yamanami +1 more | 1996-03-05 |