Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7156904 | Bonding layer forming solution, method of producing copper-to-resin bonding layer using the solution, and layered product obtained thereby | Mutsuyuki Kawaguchi, Satoshi Saito, Jun Hisada, Toshiko Nakagawa | 2007-01-02 |