Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7156904 | Bonding layer forming solution, method of producing copper-to-resin bonding layer using the solution, and layered product obtained thereby | Mutsuyuki Kawaguchi, Satoshi Saito, Naomi Kanda, Toshiko Nakagawa | 2007-01-02 |
| 7029761 | Bonding layer for bonding resin on copper surface | Mutsuyuki Kawaguchi, Satoshi Saito, Toshiko Nakagawa | 2006-04-18 |
| 6733886 | Laminate and method of manufacturing the same | Mutsuyuki Kawaguchi, Toshiko Nakagawa | 2004-05-11 |