Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8828554 | Electroconductive layer, laminate using the same, and producing processes thereof | Satoshi Saito, Tsuyoshi AMATANI, Yuko Fujii | 2014-09-09 |
| 8147631 | Method for forming a laminate | Tsuyoshi AMATANI | 2012-04-03 |
| 7156904 | Bonding layer forming solution, method of producing copper-to-resin bonding layer using the solution, and layered product obtained thereby | Satoshi Saito, Jun Hisada, Naomi Kanda, Toshiko Nakagawa | 2007-01-02 |
| 7029761 | Bonding layer for bonding resin on copper surface | Satoshi Saito, Jun Hisada, Toshiko Nakagawa | 2006-04-18 |
| 6733886 | Laminate and method of manufacturing the same | Jun Hisada, Toshiko Nakagawa | 2004-05-11 |