Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10032749 | Three-dimensional chip-to-wafer integration | Amit S. Kelkar, Karthik Thambidurai, Viren Khandekar | 2018-07-24 |
| 9472451 | Technique for wafer-level processing of QFN packages | Viren Khandekar, Karthik Thambidurai, Ahmad Ashrafzadeh, Amit S. Kelkar | 2016-10-18 |
| 9219043 | Wafer-level package device having high-standoff peripheral solder bumps | Amit S. Kelkar, Viren Khandekar | 2015-12-22 |
| 9190391 | Three-dimensional chip-to-wafer integration | Amit S. Kelkar, Karthik Thambidurai, Viren Khandekar | 2015-11-17 |
| 8860222 | Techniques for wafer-level processing of QFN packages | Viren Khandekar, Karthik Thambidurai, Ahmad Ashrafzadeh, Amit S. Kelkar | 2014-10-14 |