JC

James M. Cleeves

MS Matrix Semiconductor: 31 patents #2 of 55Top 4%
S3 Sandisk 3D: 28 patents #16 of 180Top 9%
KO Kovio: 26 patents #3 of 41Top 8%
PE Pinnacle Engines: 19 patents #1 of 7Top 15%
Cypress Semiconductor: 13 patents #135 of 1,852Top 8%
TA Thin Film Electronics Asa: 11 patents #8 of 100Top 8%
CT Candescent Technologies: 4 patents #41 of 125Top 35%
NS National Semiconductor: 3 patents #635 of 2,238Top 30%
FI Fairchild Camera & Instrument: 2 patents #30 of 173Top 20%
ST Sandisk Technologies: 2 patents #193 of 394Top 50%
Lsi Logic: 1 patents #1,146 of 1,957Top 60%
FS Fairchild Semiconductor: 1 patents #419 of 715Top 60%
SO Sony: 1 patents #17,262 of 25,231Top 70%
📍 Redwood City, CA: #7 of 5,061 inventorsTop 1%
🗺 California: #1,038 of 386,348 inventorsTop 1%
Overall (All Time): #6,594 of 4,157,543Top 1%
146
Patents All Time

Issued Patents All Time

Showing 126–146 of 146 patents

Patent #TitleCo-InventorsDate
6091129 Self-aligned trench isolated structure 2000-07-18
6034882 Vertically stacked field programmable nonvolatile memory and method of fabrication Mark G. Johnson, Thomas H. Lee, Vivek Subramanian, Paul Michael Farmwald 2000-03-07
6019658 Fabrication of gated electron-emitting device utilizing distributed particles to define gate openings, typically in combination with spacer material to control spacing between gate layer and electron-emissive elements Paul N. Ludwig, Duane A. Haven, John M. Macaulay, Christopher J. Spindt, N. Johan Knall 2000-02-01
6016012 Thin liner layer providing reduced via resistance Ahmad Chatila, Kuantai Yeh, Daniel Arnzen, Roger Caldwell 2000-01-18
6004874 Method for forming an interconnect 1999-12-21
5865659 Fabrication of gated electron-emitting device utilizing distributed particles to define gate openings and utilizing spacer material to control spacing between gate layer and electron-emissive elements Paul N. Ludwig, Duane A. Haven, John M. Macaulay, Christopher J. Spindt, N. Johan Knall 1999-02-02
5830797 Interconnect methods and apparatus 1998-11-03
5830804 Encapsulated dielectric and method of fabrication Krishnaswamy Ramkumar 1998-11-03
5710061 Disposable post processing for semiconductor device fabrication 1998-01-20
5693556 Method of making an antifuse metal post structure 1997-12-02
5686223 Method for reduced pitch lithography 1997-11-11
5652182 Disposable posts for self-aligned non-enclosed contacts 1997-07-29
5652084 Method for reduced pitch lithography 1997-07-29
5573971 Planar antifuse and method of fabrication 1996-11-12
5366929 Method for making reliable selective via fills Changhae Park, Rosemary Gettle 1994-11-22
5091047 Plasma etching using a bilayer mask James G. Heard, Zoilo Cheng Ho Tan 1992-02-25
5045150 Plasma etching using a bilayer mask James G. Heard, Zoilo Cheng Ho Tan 1991-09-03
4883772 Process for making a self-aligned silicide shunt James G. Heard 1989-11-28
4806504 Planarization method 1989-02-21
4489482 Impregnation of aluminum interconnects with copper Thomas Keyser, Michael E. Thomas, John M. Pierce 1984-12-25
4443295 Method of etching refractory metal film on semiconductor structures utilizing triethylamine and H.sub.2 O.sub.2 Kenneth Radigan 1984-04-17