Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5985692 | Process for flip-chip bonding a semiconductor die having gold bump electrodes | James A. Matthews, Trancy Tsao | 1999-11-16 |
| 5021980 | Remote measurement of temperature | Keith J. Hansen | 1991-06-04 |
| 4374915 | High contrast alignment marker for integrated circuit fabrication | C. Norman Ahlquist, Yaw Wen Hu, Peter Schoen | 1983-02-22 |