TT

Trancy Tsao

ME Microunity Systems Engineering: 1 patents #21 of 31Top 70%
Overall (All Time): #3,667,667 of 4,157,543Top 90%
1
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
5985692 Process for flip-chip bonding a semiconductor die having gold bump electrodes Paul Poenisch, James A. Matthews 1999-11-16