Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9073173 | Method for shape modification of polishing pad | Hiroshi Takai | 2015-07-07 |
| 8728942 | Method for producing epitaxial silicon wafer | Shinichi Ogata, Kazushige Takaishi, Hironori Nishimura, Shigeru Okuuchi, Shunsuke Mikuriya | 2014-05-20 |
| 8545712 | Semiconductor wafer manufacturing method | Hiroshi Takai, Kenji Satomura, Katsutoshi Yamamoto, Kouji Mizowaki | 2013-10-01 |
| 8296961 | Polishing pad thickness measuring method and polishing pad thickness measuring device | Hiroshi Takai, Hironori Nishimura | 2012-10-30 |
| 6517667 | Apparatus for polishing a semiconductor wafer | — | 2003-02-11 |
| 6495465 | Method for appraising the condition of a semiconductor polishing cloth | Naoki Yamada | 2002-12-17 |
| 6090688 | Method for fabricating an SOI substrate | Tadashi Ogawa, Akihiro Ishii | 2000-07-18 |
| 6004860 | SOI substrate and a method for fabricating the same | Tadashi Ogawa, Akihiro Ishii | 1999-12-21 |
| 6001007 | Template used for polishing a semiconductor wafer | Masahiko Maeda | 1999-12-14 |
| 5893755 | Method of polishing a semiconductor wafer | — | 1999-04-13 |
| 5863829 | Process for fabricating SOI substrate | Hiroaki Yamamoto, Akihiro Ishii | 1999-01-26 |