HC

Haiguang Chen

KL Kla-Tencor: 28 patents #83 of 1,394Top 6%
BC Beijing Bayi Space Lcd Technology Co.: 4 patents #1 of 24Top 5%
University of California: 3 patents #2,984 of 18,278Top 20%
KL Kla: 1 patents #347 of 758Top 50%
📍 Mountain View, CA: #430 of 11,022 inventorsTop 4%
🗺 California: #12,730 of 386,348 inventorsTop 4%
Overall (All Time): #89,262 of 4,157,543Top 3%
37
Patents All Time

Issued Patents All Time

Showing 26–37 of 37 patents

Patent #TitleCo-InventorsDate
7373277 Methods and systems for detection of selected defects particularly in relatively noisy inspection data Sean F. Wu, Michael D. Kirk 2008-05-13
7332438 Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool Kurt Lehman, Charles Chen, Ronald L. Allen, Robert Shinagawa, Anantha R. Sethuraman +3 more 2008-02-19
7175503 Methods and systems for determining a characteristic of polishing within a zone on a specimen from combined output signals of an eddy current device Kurt Lehman, Charles Chen, Ronald L. Allen, Robert Shinagawa, Anantha R. Sethuraman +3 more 2007-02-13
7052369 Methods and systems for detecting a presence of blobs on a specimen during a polishing process Kurt Lehman, Charles Chen, Ronald L. Allen, Robert Shinagawa, Anantha R. Sethuraman +3 more 2006-05-30
7030018 Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool Kurt Lehman, Charles Chen, Ronald L. Allen, Robert Shinagawa, Anantha R. Sethuraman +3 more 2006-04-18
6935922 Methods and systems for generating a two-dimensional map of a characteristic at relative or absolute locations of measurement spots on a specimen during polishing Kurt Lehman, Charles Chen, Ronald L. Allen, Robert Shinagawa, Anantha R. Sethuraman +3 more 2005-08-30
6884146 Systems and methods for characterizing a polishing process Kurt Lehman, Charles Chen, Ronald L. Allen, Robert Shinagawa, Anantha R. Sethuraman +3 more 2005-04-26
6866559 Windows configurable to be coupled to a process tool or to be disposed within an opening in a polishing pad Kurt Lehman, Charles Chen, Ronald L. Allen, Robert Shinagawa, Anantha R. Sethuraman +3 more 2005-03-15
6514775 In-situ end point detection for semiconductor wafer polishing Shing Lee 2003-02-04
5602934 Adaptive digital image signal filtering Jianhua Li 1997-02-11
5578923 T2 restoration and noise suppression of hybrid MR images using wiener and linear prediction techniques 1996-11-26
5517122 T2 restoration and noise suppression of hybrid MR images using Wiener and linear prediction techniques 1996-05-14