Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8902565 | Electronic component termination and assembly by means of transient liquid phase sintering and polymer solder pastes | John E. McConnell, John Bultitude, Reggie Phillips, Garry L. Renner, Philip M. Lessner +3 more | 2014-12-02 |