Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10068708 | Method for stacking electronic components | Maurice Perea, R Allen Hill | 2018-09-04 |
| 9847175 | Method for stacking electronic components | Maurice Perea, R Allen Hill | 2017-12-19 |
| 9799449 | Multilayered ceramic capacitor with improved lead frame attachment | R. Allen Hill, Philip M. Lessner, Keith Brown, James B. Byrd | 2017-10-24 |
| 8902565 | Electronic component termination and assembly by means of transient liquid phase sintering and polymer solder pastes | John E. McConnell, John Bultitude, Robert Allen Hill, Garry L. Renner, Philip M. Lessner +3 more | 2014-12-02 |
| 8873219 | Method for stacking electronic components | Maurice Perea, Allen Hill | 2014-10-28 |
| 8331078 | Leaded multi-layer ceramic capacitor with low ESL and low ESR | John E. McConnell, Alan P. Webster, John Bultitude, Mark R. Laps, Lonnie G. Jones +1 more | 2012-12-11 |