Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6096836 | (Hetero)aromatic ether, (thio)ester or (thio)carbonate epoxy catalyst | Shuzi Hayase, Yoshihiko Nakano, Shinji Murai | 2000-08-01 |
| 5811497 | Aromatic curing catalyst for epoxy resins | Shuzi Hayase, Yoshihiko Nakano, Shinji Murai | 1998-09-22 |
| 5578697 | Polyimide precursor, bismaleimide-based cured resin precursor and electronic parts having insulating members made from these precursors | Yoshiaki Kawamonzen, Masayuki Oba, Shigeru Matake, Shuzi Hayase, Satoshi Mikoshiba | 1996-11-26 |
| 5518864 | Method of forming polyimide film pattern | Masayuki Oba, Rumiko Hayase, Naoko Kihara, Shuzi Hayase, Yoshihiko Nakano +3 more | 1996-05-21 |
| 5372908 | Photosensitive composition comprising a polysilane and an acid forming compound | Shuji Hayase, Yoshihiko Nakano | 1994-12-13 |
| 5362559 | Polysilane monomolecular film and polysilane built-up film | Shuji Hayase, Yoshihiko Nakano, Akira Yoshizumi, Shinji Murai, Rikako Kani | 1994-11-08 |
| 5348835 | Photosensitive resin composition for forming polyimide film pattern comprising an o-quinone diazide photosensitive agent | Masayuki Oba, Rumiko Hayase, Naoko Kihara, Shuzi Hayase, Yoshihiko Nakano +3 more | 1994-09-20 |
| 5340684 | Photosensitive composition and resin-encapsulated semiconductor device | Rumiko Hayase, Masayuki Oba, Naoko Kihara | 1994-08-23 |
| 5336736 | Polysilane and polysilane composition | Yoshihiko Nakano, Shuzi Hayase, Shinji Murai, Akira Yoshizumi | 1994-08-09 |
| 5176982 | Photosensitive resin composition for forming a polyimide film pattern | Shuzi Hayase, Yoshihiko Nakano | 1993-01-05 |
| 4829134 | Epoxy resin composition | Tsuguo Sakamoto, Kazuhiko Kurematsu, Shuichi Suzuki, Cao Minh Thai | 1989-05-09 |
| 4816496 | Photocurable composition | Moriyasu Wada, Shuichi Suzuki, Yuusuke Wada, Shuzi Hayase | 1989-03-28 |
| 4555324 | Porous gas diffusion electrode and method of producing the same | Mitsushi Ueno, Tamotsu Shirogami | 1985-11-26 |
| 4309512 | Heat-resistant thermosetting resin composition | Takeo Ito, Moriyasu Wada | 1982-01-05 |