MO

Masayuki Oba

KT Kabushiki Kaisha Toshiba: 9 patents #3,402 of 21,451Top 20%
MI Mitsui Toatsu Chemicals, Incorporated: 8 patents #151 of 1,543Top 10%
Overall (All Time): #280,415 of 4,157,543Top 7%
17
Patents All Time

Issued Patents All Time

Showing 1–17 of 17 patents

Patent #TitleCo-InventorsDate
6159654 Negative photosensitive polymer composition of a thermosetting polymer precursor curable by cyclodehydration upon heating Shigeru Machida, Yoshiaki Kawamonzen 2000-12-12
5756254 Resist, method of forming a resist pattern and manufacturing an electronic parts using the resist Naoko Kihara, Satoshi Saito, Hiromitsu Wakabayashi, Makoto Nakase 1998-05-26
5756650 Polyimide precursor composition, method of forming polyimide film, electronic parts and liquid crystal element Yoshiaki Kawamonzen, Satoshi Mikoshiba, Shigeru Matake 1998-05-26
5753407 Polyamic acid composition 1998-05-19
5585217 Polyamic acid composition 1996-12-17
5578697 Polyimide precursor, bismaleimide-based cured resin precursor and electronic parts having insulating members made from these precursors Yoshiaki Kawamonzen, Yukihiro Mikogami, Shigeru Matake, Shuzi Hayase, Satoshi Mikoshiba 1996-11-26
5518864 Method of forming polyimide film pattern Rumiko Hayase, Naoko Kihara, Shuzi Hayase, Yukihiro Mikogami, Yoshihiko Nakano +3 more 1996-05-21
5348835 Photosensitive resin composition for forming polyimide film pattern comprising an o-quinone diazide photosensitive agent Rumiko Hayase, Naoko Kihara, Shuzi Hayase, Yukihiro Mikogami, Yoshihiko Nakano +3 more 1994-09-20
5340684 Photosensitive composition and resin-encapsulated semiconductor device Rumiko Hayase, Naoko Kihara, Yukihiro Mikogami 1994-08-23
4506042 Curable resin composition comprising N-(alkenylphenyl)maleimide, epoxy composition and polyamine Hikotada Tsuboi, Motoo Kawamata, Nobuhito Koga 1985-03-19
4500719 Process for the preparation of N-alkenylphenylmaleimides and N,N'-[alkenylenephenylene]bismalemides Motoo Kawamata, Hikotada Tsuboi, Nobuhito Koga 1985-02-19
4401777 Curable resin composition comprising N-(alkenylphenyl)maleimide and epoxy composition Hikotada Tsuboi, Motoo Kawamata, Nobuhito Koga 1983-08-30
4400521 N-Substituted phenyl maleimides Motoo Kawamata, Hikotada Tsuboi, Nobuhito Koga 1983-08-23
4376206 N-Alkenylphenylmaleimides and N,N'-[alkenylene phenylene]bismaleimides for the same Motoo Kawamata, Hikotada Tsuboi, Nobuhito Koga 1983-03-08
4323662 Thermosetting resin compositions comprising bismaleimides and alkenylaniline derivatives Motoo Kawamata, Hikotada Tsuboi, Nobuhito Koga 1982-04-06
4289699 Process for the production of N-(hydroxyphenyl) maleimides Motoo Kawamata, Hikotada Tsuboi, Nobuhito Koga 1981-09-15
4231934 Process for the production of N-(hydroxyphenyl) maleimides Motoo Kawamata, Hikotada Tsuboi, Nobuhito Koga 1980-11-04