Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6645643 | Polymeric composition for packaging a semiconductor electronic device and packaging obtained therefrom | Roberto Zafarana, Antonino Scandurra, Salvatore Pignataro, Yuichi Tenya | 2003-11-11 |
| 5907382 | Transparent conductive substrate and display apparatus | Sadao Kajiura, Toshiro Hiraoka | 1999-05-25 |
| 5853952 | Color developing organic material, color developing resin composition and colored thin film pattern | Toru Ushirogouchi, Makoto Nakase, Naoko Kihara, Takuya Naito, Naomi Shida +1 more | 1998-12-29 |
| 5747557 | Method of manufacturing a castable epoxy resin composition comprising acrylic rubber particles predispersed in an anhydride hardener | Koshi Hanyu | 1998-05-05 |
| 5641997 | Plastic-encapsulated semiconductor device | Hideo Ohta, Tetsuo Okuyama, Shinetsu Fujieda, Sadao Kajiura | 1997-06-24 |
| 5637667 | Thermosetting resin composition | Hiroshi Shimozawa, Shinetsu Fujieda, Shuzi Hayase, Yoshihiko Nakano, Ken Uchida | 1997-06-10 |
| 5438113 | Thermosetting resin composition | Hiroshi Shimozawa, Shinetsu Fujieda, Shuzi Hayase, Yoshihiko Nakano, Ken Uchida | 1995-08-01 |
| 5362559 | Polysilane monomolecular film and polysilane built-up film | Shuji Hayase, Yoshihiko Nakano, Yukihiro Mikogami, Shinji Murai, Rikako Kani | 1994-11-08 |
| 5336736 | Polysilane and polysilane composition | Yoshihiko Nakano, Shuzi Hayase, Shinji Murai, Yukihiro Mikogami | 1994-08-09 |
| 5325583 | Method for manufacturing printed circuit board | Seizaburo Shimizu, Osamu Sasaki, Hideo Ohta | 1994-07-05 |
| 5272377 | Maleimide resin composition and resin encapsulated semiconductor device manufactured using the composition | Hiroshi Shimozawa, Shinetsu Fujieda, Michiya Higashi | 1993-12-21 |
| 5258426 | Semiconductor device encapsulant | Ken Uchida, Shinetsu Fujieda, Michiya Higashi, Hiroshi Shimozawa | 1993-11-02 |
| 5252639 | Molding resin composition and molded electronic component | Shinetsu Fujieda, Kazutaka Matsumoto, Hisayuki Hirai | 1993-10-12 |
| 5216077 | Rubber-modified phenolic resin composition and method of manufacturing the same | Shinetsu Fujieda, Ken Uchida, Naoko Kihara, Kazuhiro Sawai, Tsutomu Nagata +2 more | 1993-06-01 |
| 5043211 | Epoxy resin composition and a resin-sealed semiconductor device | Kazutaka Matsumoto, Shinetsu Fujieda, Ken Uchida | 1991-08-27 |
| 4921537 | Shrinkage compensated mortar material | Kazuo Horiguchi, Kazuyoshi Hosaka | 1990-05-01 |
| 4916174 | Rubber-modified phenolic resin composition and method of manufacturing the same | Shinetsu Fujieda, Ken Uchida, Naoko Kihara, Kazuhiro Sawai, Tsutomu Nagata +2 more | 1990-04-10 |
| 4719255 | Epoxy resin composition for encapsulation of semi-conductor device | Hisayuki Hirai, Kazutaka Matsumoto, Shinetsu Fujieda, Michiya Higashi | 1988-01-12 |
| 4248920 | Resin-sealed semiconductor device | Hirotoshi Ikeya, Moriyasu Wada | 1981-02-03 |