Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5536970 | Resin-encapsulated semiconductor device | Cao Minh Thai | 1996-07-16 |
| 5346743 | Resin encapsulation type semiconductor device | Ken Uchida, Shinetsu Fujieda | 1994-09-13 |
| 5272377 | Maleimide resin composition and resin encapsulated semiconductor device manufactured using the composition | Hiroshi Shimozawa, Shinetsu Fujieda, Akira Yoshizumi | 1993-12-21 |
| 5258426 | Semiconductor device encapsulant | Ken Uchida, Shinetsu Fujieda, Hiroshi Shimozawa, Akira Yoshizumi | 1993-11-02 |
| 5145889 | Acid anhydride-cured epoxy resin encapsulant with triorganothiophosphite | Yusuke Wada | 1992-09-08 |
| 5068267 | Semiconductor device encapsulant consisting of epoxy resin composition | Ken Uchida, Naoko Kihara, Hiroshi Shimozawa, Akira Yoshizumo | 1991-11-26 |
| 5057457 | Multimold semiconductor device and the manufacturing method therefor | Syouichi Miyahara, Keiji Kamasaki | 1991-10-15 |
| 4719255 | Epoxy resin composition for encapsulation of semi-conductor device | Akira Yoshizumi, Hisayuki Hirai, Kazutaka Matsumoto, Shinetsu Fujieda | 1988-01-12 |
| 4719502 | Epoxy resin composition, and resin-sealed semiconductor device in which this composition is used | Hirotoshi Ikeya | 1988-01-12 |
| 4710796 | Resin encapsulation type semiconductor device by use of epoxy resin composition | Hirotoshi Ikeya | 1987-12-01 |