Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7141647 | Image file arrangement for use with an improved image quality assurance system | Shioko Saya, Taro Fukaya, Shinetsu Fujieda | 2006-11-28 |
| 7138435 | Method of decomposing thermosetting resin, apparatus and heat control program | Yumiko Oyasato, Shioko Saya, Shinetsu Fujieda, Tomiaki Furuya | 2006-11-21 |
| 6949814 | Mounting material, semiconductor device and method of manufacturing semiconductor device | Hiroshi Tateishi, Koichi Teshima, Masahiro Tadauchi, Izuru Komatsu, Tetsuji Hori | 2005-09-27 |
| 6465531 | Method for recycling thermoset resin materials | Takeshi Gotanda | 2002-10-15 |
| 6225701 | Semiconductor device provided with heat-sink and method of manufacturing the same | Tetsuji Hori | 2001-05-01 |
| 5589129 | Method of manufacturing a molding using a filler or an additive concentrated on an arbitrary portion or distributed at a gradient concentration | Tsuguo Kato | 1996-12-31 |
| 5536970 | Resin-encapsulated semiconductor device | Michiya Higashi | 1996-07-16 |
| 4829134 | Epoxy resin composition | Tsuguo Sakamoto, Kazuhiko Kurematsu, Yukihiro Mikogami, Shuichi Suzuki | 1989-05-09 |
| 4617330 | Epoxy resin composition for cast molding | Takayuki Oguni, Kazuhiko Kurematsu, Tsuguo Kato | 1986-10-14 |