TH

Tetsuji Hori

KT Kabushiki Kaisha Toshiba: 7 patents #4,294 of 21,451Top 25%
Tdk: 4 patents #1,273 of 3,796Top 35%
FI Fujimi Incorporated: 2 patents #88 of 216Top 45%
FA Fujimi America: 1 patents #4 of 5Top 80%
Overall (All Time): #385,016 of 4,157,543Top 10%
13
Patents All Time

Issued Patents All Time

Showing 1–13 of 13 patents

Patent #TitleCo-InventorsDate
8529777 Method of making a mask, method of patterning by using this mask and method of manufacturing a micro-device Hisayoshi Watanabe, Hideyuki Yatsu, Takayuki Nishizawa, Masashi Sano, Hiromichi Umehara +1 more 2013-09-10
8379346 Method of forming metal to a concave portion of a substrate, method of manufacturing a magnetic head and a magnetic head Hisayoshi Watanabe, Yuji Matsuura, Takayuki Nishizawa, Masashi Sano 2013-02-19
7867060 Retainer ring used for polishing a structure for manufacturing magnetic head, and polishing method using the same Hiroki Aritomo, Akira Miyasaka, Youji Hirao 2011-01-11
7699901 Alumina-film-polishing composition and chemical mechanical polishing method using the same 2010-04-20
7217989 Composition for selectively polishing silicon nitride layer and polishing method employing it Ai Hiramitsu, Takashi Ito 2007-05-15
6949814 Mounting material, semiconductor device and method of manufacturing semiconductor device Cao Minh Thai, Hiroshi Tateishi, Koichi Teshima, Masahiro Tadauchi, Izuru Komatsu 2005-09-27
6673310 Solder material, device using the same and manufacturing process thereof Masahiro Tadauchi, Izuru Komatsu, Hiroshi Tateishi, Kouichi Teshima, Kazutaka Matsumoto 2004-01-06
D475982 Semiconductor device Takayuki Yoshihira, Yuuji Hiyama, Gentaro Ookura 2003-06-17
D475355 Semiconductor device Takayuki Yoshihira, Yuuji Hiyama, Gentaro Ookura 2003-06-03
D475028 Semiconductor device Takayuki Yoshihira, Yuuji Hiyama, Gentaro Ookura 2003-05-27
6469398 Semiconductor package and manufacturing method thereof 2002-10-22
6355075 Polishing composition Katsuyoshi Ina, W. Scott Rader, David M. Shemo 2002-03-12
6225701 Semiconductor device provided with heat-sink and method of manufacturing the same Cao Minh Thai 2001-05-01