Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5068267 | Semiconductor device encapsulant consisting of epoxy resin composition | Ken Uchida, Michiya Higashi, Naoko Kihara, Hiroshi Shimozawa | 1991-11-26 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5068267 | Semiconductor device encapsulant consisting of epoxy resin composition | Ken Uchida, Michiya Higashi, Naoko Kihara, Hiroshi Shimozawa | 1991-11-26 |