YN

Yasushi Nakasaki

KT Kabushiki Kaisha Toshiba: 33 patents #712 of 21,451Top 4%
Kioxia: 3 patents #479 of 1,813Top 30%
Toshiba Memory: 3 patents #621 of 1,971Top 35%
Overall (All Time): #82,144 of 4,157,543Top 2%
39
Patents All Time

Issued Patents All Time

Showing 26–39 of 39 patents

Patent #TitleCo-InventorsDate
7943984 Nonvolatile semiconductor memory apparatus Masahiro Koike, Yuuichiro Mitani, Masato Koyama 2011-05-17
7834408 Semiconductor device and method for manufacturing the same Yuuichi Kamimuta, Akira Nishiyama, Tsunehiro Ino, Masato Koyama 2010-11-16
7816215 Semiconductor device manufacturing method Daisuke Matsushita, Koichi Muraoka, Seiji Inumiya, Koichi Kato, Kazuhiro Eguchi +1 more 2010-10-19
7772129 Method for manufacturing a semiconductor device Daisuke Matsushita, Koichi Muraoka, Koichi Kato, Yuichiro Mitani 2010-08-10
7749919 Semiconductor device and method for manufacturing the same Kiwamu Sakuma, Daisuke Matsushita, Koichi Kato, Izumi Hirano, Kouichi Muraoka +3 more 2010-07-06
7728379 Semiconductor device and method of manufacturing same Takuya Konno, Yoshio Ozawa, Tetsuya Kai, Yuuichiro Mitani 2010-06-01
7646072 Semiconductor device and method for manufacturing the same Yuuichi Kamimuta, Akira Nishiyama, Tsunehiro Ino, Masato Koyama 2010-01-12
7586163 Semiconductor device having an electrode containing boron and manufacturing method thereof Koichi Kato, Daisuke Matsushita, Koichi Muraoka, Yuichiro Mitani, Nobutoshi Aoki 2009-09-08
7498643 Semiconductor device and method for manufacturing the same Yuuichi Kamimuta, Akira Nishiyama, Tsunehiro Ino, Masato Koyama 2009-03-03
7238997 Semiconductor device and method of manufacturing the same Daisuke Matsushita, Koichi Muraoka, Koichi Kato, Takashi Shimizu 2007-07-03
6849192 Surface treating method 2005-02-01
6689284 Surface treating method 2004-02-10
6054371 Method of manufacturing a semiconductor device by detachably mounting substrates to a holder board Masakatsu Tsuchiaki, Akira Nishiyama, Yukihito Oowaki, Hirotaka Nishino 2000-04-25
5084412 Method of manufacturing a semiconductor device with a copper wiring layer 1992-01-28