Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10312144 | Method of dividing a wafer by back grinding | Hideki Koshimizu, Yurika Araya, Tetsukazu Sugiya | 2019-06-04 |
| 9716040 | Wafer processing method using adhesive tape to pick up device chips | Hideki Koshimizu, Yurika Araya, Tetsukazu Sugiya | 2017-07-25 |
| 9680094 | Memory device and method for manufacturing the same | Shosuke Fujii | 2017-06-13 |
| 9105838 | Nonvolatile variable resistive device | Reika Ichihara, Haruka Kusai | 2015-08-11 |
| 8664632 | Memory device | Daisuke Matsushita, Shosuke Fujii, Yoshifumi Nishi, Akira Takashima, Takayuki Ishikawa +3 more | 2014-03-04 |