Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10937697 | Method of processing a semiconductor wafer that involves cutting to form grooves along the dicing lines and grinding reverse side of the wafer | — | 2021-03-02 |
| 10825678 | Wafer processing method | — | 2020-11-03 |
| 10707129 | Processing method of wafer | Heidi Lan | 2020-07-07 |
| 10366925 | Wafer processing method | — | 2019-07-30 |
| 10312144 | Method of dividing a wafer by back grinding | Hideki Koshimizu, Yurika Araya, Takashi Haimoto | 2019-06-04 |
| 9852949 | Wafer processing method | Xin Lu | 2017-12-26 |
| 9786509 | Wafer processing method | Ryosuke Nishihara, Minoru Matsuzawa, Kohei TSUJIMOTO | 2017-10-10 |
| 9716040 | Wafer processing method using adhesive tape to pick up device chips | Takashi Haimoto, Hideki Koshimizu, Yurika Araya | 2017-07-25 |
| 9238288 | Method for processing plate object | Susumu Hayakawa | 2016-01-19 |