Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10312144 | Method of dividing a wafer by back grinding | Yurika Araya, Tetsukazu Sugiya, Takashi Haimoto | 2019-06-04 |
| 10269639 | Method of manufacturing packaged wafer | Xin Lu, Yurika Araya | 2019-04-23 |
| 9892986 | Packaged wafer manufacturing method and device chip manufacturing method | Xin Lu, Yurika Araya | 2018-02-13 |
| 9716040 | Wafer processing method using adhesive tape to pick up device chips | Takashi Haimoto, Yurika Araya, Tetsukazu Sugiya | 2017-07-25 |