Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6368951 | Semiconductor device manufacturing method and semiconductor device | Kazuyuki Higashi, Noriaki Matsunaga, Akihiro Kajita, Tetsuo Matsuda, Tadashi Iijima +5 more | 2002-04-09 |
| 6291891 | Semiconductor device manufacturing method and semiconductor device | Kazuyuki Higashi, Noriaki Matsunaga, Akihiro Kajita, Tetsuo Matsuda, Tadashi Iijima +5 more | 2001-09-18 |
| 6163067 | Semiconductor apparatus having wiring groove and contact hole in self-alignment manner | Masahiro Inohara, Hideki Shibata | 2000-12-19 |
| 6127256 | Semiconductor device and method of manufacturing the same | — | 2000-10-03 |
| 6051508 | Manufacturing method of semiconductor device | Tamao Takase, Hideshi Miyajima | 2000-04-18 |
| 6046502 | Semiconductor device with improved adhesion between titanium-based metal layer and insulation film | — | 2000-04-04 |
| 6004887 | Semiconductor device with improved adhesion between titanium-based metal wiring layer and insulation film | — | 1999-12-21 |
| 5976972 | Method of making semiconductor apparatus having wiring groove and contact hole formed in a self-alignment manner | Masahiro Inohara, Hideki Shibata | 1999-11-02 |
| 5966634 | Method of manufacturing semiconductor device having multi-layer wiring structure with diffusion preventing film | Masahiro Inohara, Minakshisundaran Balasubramanian Anand | 1999-10-12 |
| 5948698 | Manufacturing method of semiconductor device using chemical mechanical polishing | Masahiro Inohara | 1999-09-07 |
| 5874779 | Semiconductor device with improved adhesion between titanium-based metal wiring layer and insulation film | — | 1999-02-23 |
| 5850102 | Semiconductor device having a second insulating layer which includes carbon or fluorine at a density lower than a first insulating layer | — | 1998-12-15 |
| 5759915 | Method of forming semiconductor device having an improved buried electrode formed by selective CVD | Noriaki Matsunaga, Hideki Shibata, Takamasa Usui | 1998-06-02 |
| 5753975 | Semiconductor device with improved adhesion between titanium-based metal wiring layer and insulation film | — | 1998-05-19 |
| 5106782 | Method of manufacturing a semiconductor device | Hideki Shibata, Kazuhiko Hashimoto, Hisayo Momose | 1992-04-21 |