Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10957702 | Semiconductor memory device | Atsushi OGA, Satoshi Nagashima, Natsuki Fukuda | 2021-03-23 |
| 10833096 | Semiconductor device | Ryo Tanaka, Hiroyuki Yamasaki | 2020-11-10 |
| 10734406 | Semiconductor memory device and method of manufacturing the same | Hiroyuki Yamasaki | 2020-08-04 |
| 9035402 | Semiconductor memory device | Yoshiaki Asao | 2015-05-19 |
| 8716818 | Magnetoresistive element and method of manufacturing the same | Masatoshi Yoshikawa, Satoshi Seto, Jyunichi Ozeki, Tatsuya Kishi, Keiji Hosotani | 2014-05-06 |
| 8232197 | Method of manufacturing a semiconductor device from which damage layers and native oxide films in connection holes have been removed | Makoto Honda, Kaori Yomogihara, Kazuhiro Murakami, Masanori Numano, Takahito Nagamatsu +3 more | 2012-07-31 |
| 8053268 | Semiconductor device and method of manufacturing the same | Mari Otsuka, Hiroyuki Kamijiyo | 2011-11-08 |
| 7858465 | Semiconductor device comprising transistor and capacitor and method of manufacturing the same | Toshiaki Komukai | 2010-12-28 |
| 7605076 | Method of manufacturing a semiconductor device from which damage layers and native oxide films in connection holes have been removed | Makoto Honda, Kaori Yomogihara, Kazuhiro Murakami, Masanori Numano, Takahito Nagamatsu +3 more | 2009-10-20 |
| 7541295 | Method of manufacturing semiconductor device | Akiko Nomachi | 2009-06-02 |
| 7479433 | Method for manufacturing semiconductor device | Toshiaki Komukai | 2009-01-20 |
| 6551882 | Semiconductor device manufacturing method permitting suppression of leak current through the PN junction | Akiko Nomachi, Hiroshi Takato, Tadaomi Sakurai, Hiroshi Naruse, Koichi Kokubun | 2003-04-22 |
| 6339237 | Semiconductor device having a memory cell region and peripheral circuit region and method of manufacturing the same | Akiko Nomachi, Hiroshi Takato, Tadaomi Sakurai, Hiroshi Naruse, Koichi Kokubun | 2002-01-15 |
| 5913143 | Method of making a multilayer interconnection of semiconductor device using plug | — | 1999-06-15 |