Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6790774 | Method of forming a wiring film by applying high temperature/high pressure | Takao Fujikawa, Kohei Suzuki, Takuya Masui | 2004-09-14 |
| 6733592 | High-temperature and high-pressure treatment device | Takao Fujikawa, Yoichi Inoue, Yutaka Narukawa, Takahiko Ishii, Tsuneharu Masuda +1 more | 2004-05-11 |
| 6491518 | Apparatus for high-temperature and high-pressure treatment | Takao Fujikawa, Takahiko Ishii, Yutaka Narukawa | 2002-12-10 |
| 6455446 | High-temperature high-pressure processing method for semiconductor wafers, and an anti-oxidizing body used for the method | Yutaka Narukawa | 2002-09-24 |
| 6451682 | Method of forming interconnect film | Takao Fujikawa, Kohei Suzuki, Yasushi Mizusawa, Tomoyasu Kondou, Yoji Taguchi | 2002-09-17 |
| 6328560 | Pressure processing apparatus for semiconductors | Takao Fujikawa, Takahiko Ishii, Tsuneharu Masuda, Yutaka Narukawa | 2001-12-11 |
| 6299739 | Method of forming metal wiring film | Takao Fujikawa, Takahiko Ishii, Yutaka Narukawa, Yasushi Mizusawa, Tomoyasu Kondou +1 more | 2001-10-09 |
| 6285010 | Method and device for high-temperature, high-pressure treatment of semiconductor wafer | Takao Fujikawa, Yutaka Narukawa, Tsuneharu Masuda | 2001-09-04 |