Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7922783 | Polishing pad and production method thereof | Fujio Sakurai, Iwao Mihara, Yoshinori Igarashi | 2011-04-12 |
| 7323415 | Polishing pad for semiconductor wafer, polishing multilayered body for semiconductor wafer having same, and method for polishing semiconductor wafer | Hiroshi Shiho, Yukio Hosaka, Nobuo Kawahashi | 2008-01-29 |
| 7217305 | Polishing body | Hozumi Satou, Osamu Ishikawa, Yukio Hosaka | 2007-05-15 |
| 7201641 | Polishing body | Hozumi Satou, Osamu Ishikawa, Yukio Hosaka | 2007-04-10 |
| 7183213 | Chemical mechanical polishing pad and chemical mechanical polishing method | Hiroshi Shiho, Yukio Hosaka, Nobuo Kawahashi | 2007-02-27 |
| 7097550 | Chemical mechanical polishing pad | Kouji Kawahara, Fujio Sakurai | 2006-08-29 |
| 7077879 | Composition for polishing pad and polishing pad using the same | Toshihiro Ogawa, Nobuo Kawahashi | 2006-07-18 |
| 7001252 | Abrasive material | Hozumi Satou, Osamu Ishikawa, Yukio Hosaka | 2006-02-21 |
| 6992123 | Polishing pad | Hiroshi Shiho, Hiromi Aoi, Nobuo Kawahashi | 2006-01-31 |
| 6976910 | Polishing pad | Yukio Hosaka, Hiroshi Shiho, Nobuo Kawahashi | 2005-12-20 |
| 6855034 | Polishing pad for semiconductor wafer and laminated body for polishing of semiconductor wafer equipped with the same as well as method for polishing of semiconductor wafer | — | 2005-02-15 |
| 6848974 | Polishing pad for semiconductor wafer and polishing process using thereof | Yukio Hosaka | 2005-02-01 |
| 6832949 | Window member for chemical mechanical polishing and polishing pad | Tomohisa Konno, Masayuki Motonari, Masayuki Hattori, Nobuo Kawahashi | 2004-12-21 |
| 6790883 | Composition for polishing pad and polishing pad using the same | Toshihiro Ogawa, Nobuo Kawahashi | 2004-09-14 |
| 6777335 | Polishing method | — | 2004-08-17 |
| 6645264 | Composition for forming polishing pad, crosslinked body for polishing pad, polishing pad using the same and method for producing thereof | Tomoo Koumura, Yutaka Kobayashi | 2003-11-11 |
| 6341844 | Apparatus using overlaid flexible cable for electrically connecting relatively moveable parts | Yoshio Uchikata, Toshihide Wada, Tadashi Hanabusa, Tetsuyo Ohashi, Toshihiko Bekki +1 more | 2002-01-29 |
| 6153704 | Thermoplastic elastomer composition | Kazuhisa Kodama, Yoshihisa Mizuno, Hideo Nakanishi, Satoshi Yamashita, Kenji Yasuda | 2000-11-28 |
| 6022091 | Recording apparatus having an adjusting member for adjusting a guiding member toward amd away from recording material | Yoshio Uchikata, Toshihide Wada, Tadashi Hanabusa, Tetsuyo Ohashi, Toshihiko Bekki +1 more | 2000-02-08 |
| 5216448 | Ink jet recording head carriage and an apparatus with same | Yasuhiro Unosawa, Tetsuo Kimura, Masasumi Nagashima, Keiji Nagira, Hiroshi Sugitani +6 more | 1993-06-01 |
| 5105203 | Thermal transfer process with improved recording head life | Nobuyuki Kuwabara, Hideo Sugimura, Kazuhiro Nakajima, Haruhiko Moriguchi | 1992-04-14 |
| 4855758 | Thermal transfer recording apparatus with electroconductive ink | Nobuyuki Kuwabara, Hideo Sugimura, Kazuhiro Nakajima, Haruhiko Moriguchi | 1989-08-08 |