Issued Patents All Time
Showing 26–32 of 32 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4676827 | Wire for bonding a semiconductor device and process for producing the same | Naoyuki Hosoda, Naoki Uchiyama, Hideaki Yoshida, Toshiaki Ono | 1987-06-30 |
| 4659632 | Cobalt alloy for build-up welding having improved resistance to weld crack | Junya Ohe, Akifumi Mishima, Sadao Saitoh | 1987-04-21 |
| 4632806 | Copper alloy having high resistance to oxidation for use in leads on semiconductor devices | Hideaki Yoshida, Kunio Kishida | 1986-12-30 |
| 4525434 | Copper alloy having high resistance to oxidation for use in leads on semiconductor devices and clad material containing said alloy | Hideaki Yoshida, Kunio Kishida | 1985-06-25 |
| 4416853 | Cu-Ag base alloy brazing filler material | Hideaki Yoshida, Kunio Kishida, Chuji Tanaka | 1983-11-22 |
| 4411864 | Cu-Ag-Si Base alloy brazing filler material | Hideaki Yoshida, Kunio Kishida, Chuji Tanaka | 1983-10-25 |
| 4354301 | Method for manufacturing stripe-patterned metal plate | Yo Takeuchi, Chuji Tanaka, Toshiharu Hiji, Hiroshi Ikeda | 1982-10-19 |