TH

Todd H. Herder

MT Microelectronic & Computer Technology: 1 patents #56 of 112Top 50%
📍 Corvallis, OR: #1,090 of 1,763 inventorsTop 65%
🗺 Oregon: #17,068 of 28,073 inventorsTop 65%
Overall (All Time): #3,740,622 of 4,157,543Top 90%
1
Patents All Time

Issued Patents All Time

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
5508228 Compliant electrically connective bumps for an adhesive flip chip integrated circuit device and methods for forming same Ernest R. Nolan, Diana C. Duane, Thomas Alan Bishop, Kimcuc T. Tran, Robert W. Froehlich +5 more 1996-04-16