| 12156423 |
Composite film and manufacturing method thereof, and encapsulation structure including the composite film |
— |
2024-11-26 |
| 12137516 |
Package with self shielding |
Hongya Xu, Valter Pasku, Martin Handtmann, Lueder Elbrecht |
2024-11-05 |
| D1047157 |
Warm belt |
— |
2024-10-15 |
| 12113032 |
Substrate having undercut portion for stress mitigation |
YongIk Choi, Chris Y. Chung, Michael Leary, Domingo Figueredo, Chang Kyu Choi +1 more |
2024-10-08 |
| D1041022 |
Neck massager |
— |
2024-09-03 |
| 11724115 |
System and method for reducing heat of an implantable medical device during wireless charging |
Luis Ortiz Hernandez, Nicholas Sachs |
2023-08-15 |
| 11723143 |
Thermal dissipation and shielding improvement using merged PCB bottom copper post |
Chang Kyu Choi, Hyun Mo Ku, Sarah Haney |
2023-08-08 |
| D983984 |
Warm belt |
— |
2023-04-18 |
| 11276650 |
Stress mitigation structure |
YongIk Choi, Chris Y. Chung, Michael Leary, Domingo Figueredo, Chang Kyu Choi +1 more |
2022-03-15 |
| 10827617 |
Printed circuit board with cavity |
Dingyou Zhang, Nitesh Kumbhat, Sarah Haney, Chang Kyu Choi |
2020-11-03 |
| 10364504 |
Fabrication of multilayered nanosized porous membranes and their use for making novel nanostructures |
— |
2019-07-30 |
| 10134682 |
Circuit package with segmented external shield to provide internal shielding between electronic components |
Nitesh Kumbhat, Deog Soon Choi, Ashish Alawani |
2018-11-20 |
| 9997428 |
Via structures for thermal dissipation |
Marshall Maple, Ashish Alawani, Sarah Haney |
2018-06-12 |
| 9907169 |
Printed circuit board (PCB) and PCB assembly having an encapsulating mold material on a bottom surface thereof and methods for molding an encapsulating mold material on a bottom surface of a PCB |
Nitesh Kumbhat, Aaron Lee, Deog Soon Choi, Hyun Mo Ku, Jack Ajoian |
2018-02-27 |
| 9865479 |
Method of attaching components to printed cirucuit board with reduced accumulated tolerances |
Wei-Shun Wang, Ashish Alawani, Lea-Teng Lee |
2018-01-09 |