Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11973060 | Extended through wafer vias for power delivery in face-to-face dies | Joseph Minacapelli | 2024-04-30 |
| 11699662 | Face-to-face dies with probe pads for pre-assembly testing | Joseph Minacapelli | 2023-07-11 |
| 11616023 | Face-to-face dies with a void for enhanced inductor performance | Joseph Minacapelli | 2023-03-28 |
| 11127719 | Face-to-face dies with enhanced power delivery using extended TSVS | Joseph Minacapelli | 2021-09-21 |
| 8194085 | Apparatus, system, and method for graphics memory hub | Jonah M. Alben, Barry A. Wagner, Anthony Michael Tamasi | 2012-06-05 |
| 8017520 | Method of fabricating a pad over active circuit I.C. with frame support structure | Inderjit Singh, Howard Lee Marks | 2011-09-13 |
| 7791193 | Pad over active circuit system and method with meshed support structure | Inderjit Singh, Howard Lee Marks | 2010-09-07 |
| 7649269 | Pad over active circuit system and method with frame support structure | Inderjit Singh, Howard Lee Marks | 2010-01-19 |
| 7495343 | Pad over active circuit system and method with frame support structure | Inderjit Singh, Howard Lee Marks | 2009-02-24 |
| 7477257 | Apparatus, system, and method for graphics memory hub | Jonah M. Alben, Barry A. Wagner, Anthony Michael Tamasi | 2009-01-13 |
| 7453158 | Pad over active circuit system and method with meshed support structure | Inderjit Singh, Howard Lee Marks | 2008-11-18 |
| 7429528 | Method of fabricating a pad over active circuit I.C. with meshed support structure | Inderjit Singh, Howard Lee Marks | 2008-09-30 |