Issued Patents All Time
Showing 26–41 of 41 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5714804 | Semiconductor contact structure in integrated semiconductor devices | Robert O. Miller | 1998-02-03 |
| 5703728 | Support post architecture for micromechanical devices | Robert Mark Boysel | 1997-12-30 |
| 5683924 | Method of forming raised source/drain regions in a integrated circuit | Tsiu C. Chan | 1997-11-04 |
| 5682055 | Method of forming planarized structures in an integrated circuit | Kuei-Wu Huang, Tsiu C. Chan | 1997-10-28 |
| 5631782 | Support post architecture for micromechanical devices | Robert Mark Boysel | 1997-05-20 |
| 5622900 | Wafer-like processing after sawing DMDs | — | 1997-04-22 |
| 5514129 | Automatic bipolar control for an electrosurgical generator | — | 1996-05-07 |
| 5231055 | Method of forming composite interconnect system | — | 1993-07-27 |
| 5110327 | Compressed air dryer | — | 1992-05-05 |
| 5055423 | Planarized selective tungsten metallization system | Thomas D. Bonifield | 1991-10-08 |
| 5021920 | Multilevel integrated circuit capacitor and method of fabrication | — | 1991-06-04 |
| 4977106 | Tin chemical vapor deposition using TiCl4 and SiH4 | — | 1990-12-11 |
| 4963511 | Method of reducing tungsten selectivity to a contact sidewall | — | 1990-10-16 |
| 4681653 | Planarized dielectric deposited using plasma enhanced chemical vapor deposition | Andrew J. Purdes | 1987-07-21 |
| 4666211 | Multi-level transport truck apparatus | Gavin Smith, Flynn K. Smith | 1987-05-19 |
| 4184536 | Heat rejection system | Richard D. Tokarz, Harvey L. Parry, Jr., Daniel Braun | 1980-01-22 |