Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8946871 | Thermal improvement of integrated circuit packages | Allen S. Lim, Atila Mertol | 2015-02-03 |
| 7968999 | Process of grounding heat spreader/stiffener to a flip chip package using solder and film adhesive | Zafer Kutlu, Vishal Shah | 2011-06-28 |
| 6114761 | Thermally-enhanced flip chip IC package with extruded heatspreader | Atila Mertol, Farshad Ghahghahi, Zafer Kutlu | 2000-09-05 |
| 5880377 | Method for low velocity measurement of fluid flow | — | 1999-03-09 |