Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10625320 | Apparatus and method for bending a pipe and testing accuracy of a bent shape of the pipe | Masakazu Koike | 2020-04-21 |
| 7968999 | Process of grounding heat spreader/stiffener to a flip chip package using solder and film adhesive | Zeki Z. Celik, Zafer Kutlu | 2011-06-28 |