Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11901232 | Automatic kerf offset mapping and correction system for laser dicing | Karthik Balakrishnan, Jungrae Park, Sai Abhinand, James S. Papanu | 2024-02-13 |
| 11854888 | Laser scribing trench opening control in wafer dicing using hybrid laser scribing and plasma etch approach | Jungrae Park, Karthik Balakrishnan, James S. Papanu, Wei-Sheng Lei | 2023-12-26 |
| 11011424 | Hybrid wafer dicing approach using a spatially multi-focused laser beam laser scribing process and plasma etch process | Jungrae Park, James S. Papanu | 2021-05-18 |