Issued Patents All Time
Showing 1–25 of 34 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12402264 | Stacked power terminals in a power electronics module | Vemmond Jeng Hung NG, Chee Hiong CHEW | 2025-08-26 |
| 12308297 | Semiconductor package system and related methods | Chee Hiong CHEW, Atapol Prajuckamol | 2025-05-20 |
| 12300558 | Substrates and related methods | Atapol Prajuckamol, Chee Hiong CHEW, Vemmond Jeng Hung NG | 2025-05-13 |
| 12131981 | Power module package baseplate with step recess design | Vemmond Jeng Hung NG | 2024-10-29 |
| 12033904 | Semiconductor package system and related methods | Chee Hiong CHEW, Atapol Prajuckamol | 2024-07-09 |
| 11894292 | Power module | Qing Yang, Yong Liu | 2024-02-06 |
| 11804421 | Connecting clip design for pressure sintering | Atapol Prajuckamol, Chee Hiong CHEW | 2023-10-31 |
| 11735504 | Power module package baseplate with step recess design | Vemmond Jeng Hung NG | 2023-08-22 |
| 11710687 | Semiconductor package with guide pin | Chee Hiong CHEW, Atapol Prajuckamol, Chuncao NIU | 2023-07-25 |
| 11672087 | Semiconductor package | Atapol Prajuckamol, Chee Hiong CHEW | 2023-06-06 |
| 11482468 | Power module package casing with protrusion supports | Vemmond Jeng Hung NG, Chee Hiong CHEW, Qing Yang | 2022-10-25 |
| 11452225 | Fin frame assemblies | Atapol Prajuckamol, Chee Hiong CHEW | 2022-09-20 |
| 11342237 | Semiconductor package system and related methods | Chee Hiong CHEW, Atapol Prajuckamol | 2022-05-24 |
| 11315859 | Power module | Qing Yang, Yong Liu | 2022-04-26 |
| 11272625 | Method for forming a semiconductor package | Atapol Prajuckamol, Chee Hiong CHEW | 2022-03-08 |
| 11081828 | Power module housing | Jihwan Kim, Bosung WON, Atapol Prajuckamol, Olaf Zschieschang | 2021-08-03 |
| D922329 | Press-fit pin case | Jihwan Kim, Bosung WON, Atapol Prajuckamol, Olaf Zschieschang | 2021-06-15 |
| 10971428 | Semiconductor baseplates | Atapol Prajuckamol, Francis J. Carney, Chee Hiong CHEW | 2021-04-06 |
| 10966335 | Fin frame assemblies | Atapol Prajuckamol, Chee Hiong CHEW | 2021-03-30 |
| 10897821 | Method of making single reflow power pin connections | Atapol Prajuckamol, Chee Hiong CHEW, Francis J. Carney, Yusheng LIN | 2021-01-19 |
| 10861767 | Package structure with multiple substrates | Atapol Prajuckamol, Chee Hiong CHEW | 2020-12-08 |
| 10861775 | Connecting clip design for pressure sintering | Atapol Prajuckamol, Chee Hiong CHEW | 2020-12-08 |
| 10825748 | Semiconductor package system and related methods | Chee Hiong CHEW, Atapol Prajuckamol | 2020-11-03 |
| 10720725 | Flexible press fit pins for semiconductor packages and related methods | Chee Hiong CHEW, Atapol Prajuckamol | 2020-07-21 |
| 10559905 | Flexible press fit pins for semiconductor packages and related methods | Chee Hiong CHEW, Atapol Prajuckamol | 2020-02-11 |