Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11901327 | Wire bonding for semiconductor devices | Yang Lei, Xiaofeng Di, Zhonghua Qian, Junrong Yan | 2024-02-13 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11901327 | Wire bonding for semiconductor devices | Yang Lei, Xiaofeng Di, Zhonghua Qian, Junrong Yan | 2024-02-13 |