Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12014955 | Method for fabricating conductive layer stack and method for fabricating semiconductor device with gate contact | Che-Hsien Liao | 2024-06-18 |
| 11937420 | Memory device having word line with improved adhesion between work function member and conductive layer | Wei CHEN | 2024-03-19 |
| 11895820 | Method of manufacturing memory device having word line with improved adhesion between work function member and conductive layer | Wei CHEN | 2024-02-06 |
| 11876051 | Conductive layer stack and semiconductor device with a gate contact | Che-Hsien Liao | 2024-01-16 |
| 8304865 | Leadframe and chip package | Mei-Lin Hsieh, Chih-Hung Hsu, Kuang-Hsiung Chen, Yi-Cheng Hsu | 2012-11-06 |