Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11127655 | Memory die containing through-memory-level via structure and methods for making the same | Takumi Moriyama, Hiroshi Sasaki, Satoshi Shimizu | 2021-09-21 |
| 10381443 | Bulb-shaped memory stack structures for direct source contact in three-dimensional memory device | Kazuyo Matsumoto, Yasuo Kasagi, Satoshi Shimizu, Hiroyuki Ogawa, Jixin Yu +2 more | 2019-08-13 |
| 10115632 | Three-dimensional memory device having conductive support structures and method of making thereof | Hiroyuki Ogawa | 2018-10-30 |
| 10020363 | Bulb-shaped memory stack structures for direct source contact in three-dimensional memory device | Hiroyuki Ogawa, Yasuo Kasagi, Satoshi Shimizu, Kazuyo Matsumoto, Jixin Yu +2 more | 2018-07-10 |
| 9985098 | Bulb-shaped memory stack structures for direct source contact in three-dimensional memory device | Kazuyo Matsumoto, Yasuo Kasagi, Satoshi Shimizu, Hiroyuki Ogawa, Jixin Yu +2 more | 2018-05-29 |