Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9984993 | Bonding structure for semiconductor package and method of manufacturing the same | Min Shu, Kuan-Neng Chen, Shu-Chiao Kuo | 2018-05-29 |
| 9496238 | Sloped bonding structure for semiconductor package | Min Shu, Kuan-Neng Chen, Shu-Chiao Kuo | 2016-11-15 |
| 8375200 | Embedded device and file change notification method of the embedded device | Chien-Hua Chen | 2013-02-12 |
| 6653235 | Fabricating process for forming multi-layered metal bumps by electroless plating | Muh-Wang Liang, Pang-Min Chiang | 2003-11-25 |