Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6313413 | Wire structure of substrate for layout detection | Kun-Ching Chen, Yung-I Yeh, Su Tao | 2001-11-06 |
| 6204559 | Ball grid assembly type semiconductor package having improved chip edge support to prevent chip cracking | Chun-Hung Lin, Su Tao, Jian Chen | 2001-03-20 |