Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6011314 | Redistribution layer and under bump material structure for converting periphery conductive pads to an array of solder bumps | Jacques Leibovitz, Park-Kee Yu, Maria L. Cobarruviaz, Susan Swindlehurst, Cheng-Cheng Chang +1 more | 2000-01-04 |