Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12224207 | Method of processing a workpiece and system for processing a workpiece | Hitoshi Hoshino, Tzanimir Arguirov, Karl Heinz Priewasser | 2025-02-11 |
| 11842926 | Method of processing a substrate | Kensuke Nagaoka | 2023-12-12 |
| 11424161 | Substrate processing method | Karl Heinz Priewasser, Tzanimir Arguirov | 2022-08-23 |
| 10870169 | Laser processing apparatus and wafer producing method | Kazuya Hirata | 2020-12-22 |
| 9649723 | Processing apparatus including laser beam applying mechanism and separating means | Yoshio Umeda, Satoshi Kobayashi | 2017-05-16 |
| 9543189 | Laminated wafer processing method | Seiji Harada, Satoshi Kobayashi | 2017-01-10 |
| 8642920 | Wafer dividing apparatus and laser processing apparatus | Chikara Aikawa, Jun Abatake, Hiroto Yoshida | 2014-02-04 |