Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8399987 | Microelectronic devices including conductive vias, conductive caps and variable thickness insulating layers | Hyuekjae Lee, Taeje Cho, Yonghwan Kwon, Jung-Hwan Kim, Chiyoung Lee +1 more | 2013-03-19 |
| 8125042 | Semiconductor package and method of manufacturing the same | Jung-Hwan Kim, Un-Byoung Kang, Dong Yi, Hyung-Sun Jang, Jongkeun Jeon +2 more | 2012-02-28 |