WS

William J. Slattery

IBM: 4 patents #21,733 of 70,183Top 35%
Overall (All Time): #1,297,481 of 4,157,543Top 35%
4
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
5151559 Planarized thin film surface covered wire bonded semiconductor package H. Ward Conru, Gary H. Irish, Francis J. Pakulski, Stephen G. Starr, William Ward 1992-09-29
5086018 Method of making a planarized thin film covered wire bonded semiconductor package H. Ward Conru, Gary H. Irish, Francis J. Pakulski, Stephen G. Starr, William Ward 1992-02-04
4761332 Planarized ceramic substrates Kenneth L. Elias, Stuart R. Martin 1988-08-02
4659585 Planarized ceramic substrates Kenneth L. Elias, Stuart R. Martin 1987-04-21