Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8877631 | Interconnect arrangement and associated production methods | Manfred Engelhardt, Guenther Schindler | 2014-11-04 |
| 7807563 | Method for manufacturing a layer arrangement and layer arrangement | Zvonimir Gabric, Guenther Schindler, Gernot Steinlesberger, Andreas Stich, Martin Traving +1 more | 2010-10-05 |
| 7755160 | Plasma excited chemical vapor deposition method silicon/oxygen/nitrogen-containing-material and layered assembly | Zvonimir Gabric, Guenther Schindler | 2010-07-13 |
| 7422940 | Layer arrangement | Gunther Schindler | 2008-09-09 |
| 7259441 | Hollow structure in an integrated circuit and method for producing such a hollow structure in an integrated circuit | Siegfried Schwarzl, Zvonimir Gabric | 2007-08-21 |
| 7045070 | Method of producing an electrode configuration and method of electrically contacting the electrode configuration | Volker Weinrich, Manfred Engelhardt, Hermann Wendt | 2006-05-16 |
| 7033926 | Strip conductor arrangement and method for producing a strip conductor arrangement | Gunther Schindler, Zvonimir Gabric | 2006-04-25 |
| 7023063 | Arrangement of microstructures | Zvonimir Gabric, Siegfried Schwarzl | 2006-04-04 |
| 6825098 | Method for fabricating microstructures and arrangement of microstructures | Zvonimir Gabric, Siegfried Schwarzl | 2004-11-30 |
| 6737692 | Method for fabricating a component, and component having a metal layer and an insulation layer | Zvonimir Gabric, Volker Weinrich | 2004-05-18 |
| 6686643 | Substrate with at least two metal structures deposited thereon, and method for fabricating the same | Siegfried Schwarzl, Zvonimir Gabric | 2004-02-03 |
| 5626279 | Method for fastening a first substrate on a second substrate and employment of said method for manufacturing a three-dimensional circuit arrangement | Siegfried Schwarzl | 1997-05-06 |