| 9679861 |
Integrated circuit package with active warpage control printed circuit board mount |
— |
2017-06-13 |
| 9648728 |
Coreless organic substrate |
Susan Huang |
2017-05-09 |
| 9385060 |
Integrated circuit package with enhanced thermal conduction |
Minghao Shen |
2016-07-05 |
| 9368440 |
Embedded coaxial wire and method of manufacture |
— |
2016-06-14 |
| 8217500 |
Semiconductor device package |
— |
2012-07-10 |
| 7501709 |
BGA package with wiring schemes having reduced current loop paths to improve cross talk control and characteristic impedance |
Hong Shi, Yuanlin Xie, Tarun Verma |
2009-03-10 |
| 7391122 |
Techniques for flip chip package migration |
— |
2008-06-24 |
| 7276399 |
Method of designing a module-based flip chip substrate design |
John Y. Xie |
2007-10-02 |
| 7115988 |
Bypass capacitor embedded flip chip package lid and stiffener |
— |
2006-10-03 |
| 6864565 |
Post-passivation thick metal pre-routing for flip chip packaging |
Jon M. Long |
2005-03-08 |