Issued Patents All Time
Showing 1–25 of 25 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10418829 | Charger having retractable cooling surface | Quanming Li, Guo Yang | 2019-09-17 |
| 10292308 | Fluid coupling mating apparatus and method | Mo Bai | 2019-05-14 |
| 10117357 | Stationary cooling structure for board/chassis-level conduction cooling | Mo Bai | 2018-10-30 |
| 9851520 | Optical communication component cooling | Xing Fu, Chengpeng Yang | 2017-12-26 |
| 9813082 | Heat spreader with thermally coductive foam core | Mo Bai | 2017-11-07 |
| 9241421 | Centralized chassis architecture for half-width boards | Jiye Xu | 2016-01-19 |
| 9196564 | Apparatus and method for a back plate for heat sink mounting | Youlin Jin | 2015-11-24 |
| 8884425 | Thermal management in 2.5 D semiconductor packaging | Anwar Mohammed | 2014-11-11 |
| 8767391 | Chassis with adjustable baffle for cooling | Youlin Jin, Jiye Xu | 2014-07-01 |
| 8368205 | Metallic thermal joint for high power density chips | Seshasayee S. Ankireddi, James A. Jones, Margaret B. Stern | 2013-02-05 |
| 8331094 | Thermal and power bus stacked package architecture | Seshasayee S. Ankireddi | 2012-12-11 |
| 8283204 | Optimized lid attach process for thermal management and multi-surface compliant heat removal | Deviprasad Malladi | 2012-10-09 |
| 8097813 | Carbon nanotube based interposer | David W. Copeland | 2012-01-17 |
| 7939364 | Optimized lid attach process for thermal management and multi-surface compliant heat removal | Deviprasad Malladi | 2011-05-10 |
| 7791194 | Composite interconnect | David W. Copeland | 2010-09-07 |
| 7619308 | Multi-lid semiconductor package | David W. Copeland | 2009-11-17 |
| 7301227 | Package lid or heat spreader for microprocessor packages | Deviprasad Malladi | 2007-11-27 |
| 7187550 | Gasketed field-replaceable active integrated liquid pump heat sink module for thermal management of electronic components | Ali Heydari | 2007-03-06 |
| 7007741 | Conformal heat spreader | Bidyut Sen, Scott Kirkman | 2006-03-07 |
| 6945315 | Heatsink with active liquid base | Shlomo Novotny, Marlin R. Vogel | 2005-09-20 |
| 6836408 | Method and apparatus for force transfer via bare die package | James A. Jones | 2004-12-28 |
| 6727193 | Apparatus and methods for enhancing thermal performance of integrated circuit packages | Deviprasad Malladi | 2004-04-27 |
| 6653167 | Facilitating heat transfer from an integrated circuit package | — | 2003-11-25 |
| 6649443 | System for facilitating alignment of silicon die | — | 2003-11-18 |
| 6637506 | Multi-material heat spreader | Deviprasad Malladi | 2003-10-28 |